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深圳市龙岗中心城五联一路七号金洲科技园
Professional Solutions
Industry Leader
具有全球领先的微钻自动化生产和质检设备,确保质量领先
Equipped with globally leading micro-drill automated production and quality inspection equipment to ensure quality leadership
Demonstration Enterprise of Single Champion in Manufacturing (First Batch)
2023 Intelligent Manufacturing Demonstration Factory Unveiling
The Second Prize of the National Science and Technology Progress
Drafting Organizations of Cemented Carbide Drills for Printed Boards
(GB/T 28248-2012)
General Specification of Tungsten Carbide Routers And Endmills for Printed Circuit Boards
(T/CPCA 4405-2020)
Carbide Drills and Routers Packaging Box for Printed Circuit Boards
(T/CPCA 019―2025)
1986
Established in 1986
500+
500+ Global Patents & Innovations
9000W+
90million pcs Monthly Output of Micro Drills
22
Serving 22 Countries & Regions Worldwide
600+
Trusted by 600+ Global Clients
200+
200+R&D Experts (Ph.D.& Masters)
Latest Product
News

2026-04-20
为突破算力与能效瓶颈,Rubin Ultra架构从“水平托盘+铜缆互联”升级为“垂直刀片+零线缆中板直连”,推动PCB采用全新材料和工艺标准。 架构变革驱动正交背板板材向PTFE+M8级混压结构转变。为提升加工品质,金洲推出HLF系列钻头,直面加工困局。

2026-05-12
AI PCB产能竞争日趋白热化,3个月厂房建设、6个月达产已成常态,留给产线安装投产的时间越来越短。 4月,金洲DIMS再传捷报:吉安双客户复购项目极速落地,同期海外客户前置验收圆满收官。


2026-04-17
随着AI算力提升,M9级别板材厚径比突破30倍,加工难度倍增。 金洲HLP系列微钻凭借纳米涂层与精妙结构,继攻克4.5mm难关之后,又完成6.5mm Q布厚板实战验证。
