封装板是连接芯片与主板之间的桥梁，对芯片起到支撑和保护作用，
其特征在于高密度线路设计、成品的高精度及轻薄化；
作为高精密原件-芯片的载体，
其对于板材的孔粗品质和孔位精度有着极高的要求。
The packaging substrate serves as a bridge between the chip and the main board.
providing support and protection for the chip.
Its features lie in high-density circuit design,high precision of finished products and thinness and lightness.
As the carrier of high-precision components - chips
It has extremely high requirements for the hole diameter quality and hole position accuracy of the sheet material.
